Bernhard Rebhan, J. Svoboda, Martin Panholzer,
"A thermodynamic study of voiding phenomena in Cu?Cu thermocompression"
, in Microsystem Technologies, Springer Verlag, 8-2017, ISSN: 0946-7076
Original Titel:
A thermodynamic study of voiding phenomena in Cu?Cu thermocompression
Sprache des Titels:
Englisch
Original Kurzfassung:
The influence of wafer bonding and post-bond
annealing conditions on the (cavity) void size and distribution
was investigated theoretically and verified experimentally.
Based on Cu?Cu thermo-compression bonding at
175°C for 30 min and subsequent annealing at 200°C for
1, 6 and 24 h, respectively, in both cases the total void
surface reduces with the duration of the heat treatment,
showing good correlation between theory and experiment.
However, the experimental results revealed that the average
void size increases while voids number decreases,
which is a deviation from the prediction of the physical model.
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