Thermal Condition Monitoring System Fully Printed on a 3D Substrate
Sprache des Titels:
Englisch
Original Buchtitel:
Proceedings IEEE Sensors 2019
Original Kurzfassung:
In this work we present a condition monitoring
device which is fabricated in a low cost printing process directly
on the 3D shaped substrate. The temperature monitoring is
performed by 24 thermocouples resulting in a 24 pixel
temperature image of the sample. The thermocouples are printed
in an array arrangement, which enables the reduction of the
required connections from 48 to 25. The printing is performed in
a two-step process in which first the sensor pattern is screen
printed onto a transfer foil and then transferred in a second step
onto the target substrate by water transfer printing.
Forschungs-