Porous Silicon Substrates for Thermal Sensors and Devices
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
The 13th Mechatronics Forum International Conference
Sprache des Tagungstitel:
Englisch
Original Kurzfassung:
The miniaturization of thermal devices, such as microheaters, temperature sensors, gas and humidity sensors, and thermal flow sensors usually relies on the fabrication of ever thinner membranes using low thermal conductive materials, in order to reduce thermal losses into the substrate and thus improve sensitivity and efficiency. In our work we have been investigating the use of porous silicon substrates and membranes for such devices. Single-crystalline porous silicon can be electrochemically etched directly from bulk silicon yielding a wide range of possible porosities. This process allows for considerable reduction of the thermal conductivity along with improved mechanical stability. In this work we will present fabrication details of this technology as well as device characterization using heater ? sensor structures deposited on porous silicon substrates and membranes.
Forschungs-