We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a
platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss
laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.
Forschungs-