Did we Test Enough? Functional Coverage for Post-Silicon Validation
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
International Test Conference in Asia (ITC-Asia)
Sprache des Tagungstitel:
Englisch
Original Kurzfassung:
The ever increasing complexity of modern systems
remains a challenge for semiconductor companies. Once a new
chip has been produced, it has to be ensured that it works
properly. To this end, sophisticated test environments and test
programs are applied. However, to ensure that the applied test
program indeed fully covers all important details of the produced
chip remains a big challenge. In this work, we propose a methodology
which supports the designer by analyzing the coverage of a
given test program. To this end, we utilize accomplishments from
coverage analysis for functional verification at other abstraction
levels. A discussion of the resulting application scenario eventually
shows that this allows for an efficient coverage analysis for test
programs with basically no changes in the work-flows of test
program developers.
Forschungs-