Dielectric cure monitoring of thermoset prepreg composites
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
21st European Conference on Composite Materials
Sprache des Tagungstitel:
Englisch
Original Kurzfassung:
This study explores the practical implementation of dielectric analysis (DEA) for real-time monitoring of the curing process of thermoset prepregs, focusing on phenol-formaldehyde-based resin-impregnated paper, a B-stage resin system. These resin-impregnated papers were subjected to high-temperature and pressure conditions in a hot press, transforming them into composites intended for the furniture industry. Understanding the curing behavior is crucial for composite panel manufacturers in determining an optimal pressing time that balances performance and production cost. While conventional methods like Differential Scanning Calorimetry (DSC) are commonly used to analyze curing behavior, they are limited to lab-scale testing and cannot replicate real-time industrial conditions. In contrast, DEA, a real-time cure monitoring technique, measures dielectric property changes during resin cross-linking reactions, providing essential information on the material's cure state. This proactive monitoring offers immediate detection of deviations in crucial curing parameters such as temperature and viscosity during industrial-scale composite production. By promptly identifying and addressing these deviations, manufacturers can prevent defects and ensure consistent product quality. Polyimide sensors with interdigitated electrodes were employed in this study to measure the curing behavior of resin-impregnated paper. Curing experiments for products with varying thicknesses were conducted directly on the production press under dynamic temperature conditions from room temperature to cure temperature. In these experiments log ion viscosity was calculated with respect to time at frequency of 10 kHz. ?
Forschungs-